DiTEC Polishing Compound – Fine Cut – 32oz [PC-CMPD-FCO2]

Polishing Compound – Fine Cut – 32oz

This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it’s safe for all paint types – fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.

Features:

• Effectively removes holograms
• Free of solvents and silicone
• Appearance: Cream/Paste
• Solubility: N/A
• pH: 8

Use & Application:

For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.

Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.

Specifications:

• Type: Restoration & Compounds
• Box Dimensions: 3″H x 3″W x 10″L WT: 2.35 lbs
• UPC: 850019168440

Owner’s Manual (pdf)
Brochure (pdf)